Product Name :

KA Series

Product Description
QFN Tape / Polyimide PI Tape / PCB Masking /
QFN Back Tape / Kapton Tape / High Temperature Application /
Heat Press Tape / FPC Tape
Product Introduction
♠ Used in masking operation during wave solder process on PCB, prevent electroplating liquid immersion and polluting.
♠ Insulation and high heat dissipation.
♠. High temperature fixing / holding.
♠ Wiring in heater, power supply and flexible printed circuit board.
♠ High temperature resistant, good insulation. Used in capacitor, solder mask, motor, wiring, wave solder.
♠ Printable, for use in bicycle rim – tubeless system.
♠ Optional with release liner, good for die cut into shape.


Product CodeProduct DescriptionPhysical PropertyApplications
KA105
proimages/Product_2020/Hot_white.pngKA105#50 
proimages/Product_2020/Hot_white.pngKA105#125 
 PI fiim w/ Slicone adhesive Thickness 25
50
125
um Different film thickness
(25、50、75、125um), 
with or w/o liner
For PCB gold finger masking,
painting masking
Thickness 0.5↑ kg/in
Temp. 290
KA104
proimages/Product_2020/Hot_white.pngKA104#50
 PI fiim w/ Slicone adhesive Thickness 25
50
um


For PCB gold finger masking,
painting masking
Thickness 0.5↑ kg/in
Temp. 260
proimages/Product_2020/Hot_white.pngKA214-3  PI fiim w/ Slicone adhesive Thickness 25 um
Thickness 0.1↑ kg/in
Temp. 260
KA102  PI film w/ Acrylic adhesive Thickness 25 um Battery wrapping
Thickness 0.7↑ kg/in
Temp. 180
KAL268  PI film w/ Acrylic adhesive
w/ Liner
Thickness 25 um Battery wrapping 
Thickness 0.7↑ kg/in
Temp. 180

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